Liquid Stir Welded Chill Plates

Liquid Stir Welded Chill Plates

C&H Technology offers Q-CHILL™ Coldplates invented by MaxQ Technology, used in thermal management applications for industries in renewable energy, wind turbines, high-speed rail, solar, electric vehicle, military, and large industrial drives. This innovative technology provides uniform cooling of power electronic devices from 30kW to 250kW. Manufactured using the unique friction stir welding (FSW) process to incorporate unique cooling structures, Q-CHILL™ Coldplates have great thermal performance with low pressure drops. Learn more about our liquid cooled coldplates.

Item # Length (mm) Thickness (mm) Width (mm) Compatible With Thermal Resistance (°C/W)

CHW001-MXQ-01

162 20 136 SEMIKRON SKIM 63 0.008

CHW003-MXQ-01

162 20 172 SEMIKRON SKIM 93 0.007

CHW005-MXQ-01

162 20 147 POWEREX Intellimod L-Series, INFINEON EconoPACK +, FUJI Semiconductor M629, SEMIKRON Simex 33 0.008

CHW007-MXQ-01

202 20 130 VISHAY Dual Int-A-Pak, VISHAY Dual Int-A-Pak (Low Profile), POWEREX 62mm Package, FUJI Semiconductor M127, M234, M235, INFINEON 62mm Package, SEMIKRON SEMiTRANS Case D56 0.008

CHW009-MXQ-01

198 20 147 VISHAY Xmap, SEMIKRON SEMiX 3, INFINEON EconoDUAL 3, FUJI 122mm x 62mm Package, POWEREX NX-M Package 0.009

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