Bonded Fin Heat Sinks

Bonded Fin Heat Sinks

Bonded fin and folded fin air cooled heat sinks tailored for power electronic semiconductors and assemblies. High fin density heat sinks offer very low thermal resistance.

  • Single Fan, Double Fan and Triple Fan bonded fin heat sinks available with thermal resistance as low as .0175 C/W.
  • Custom Bonded Fin heat sinks are available enabling the engineer with the ability, to tailor their cooling requirements to a specific design.
  • Custom bonded fin copper heat sinks with up to 3X the cooling of aluminum heat sinks.
  • High performance Impingement Bonded Fin Heat Sinks with extremely low cost per watt.
  • Variety of plating options available including anodizing, chromating, RoHS compliant Alodine 5200 and Acculabs 628.
Item # Length (in) Width (in) Height (in) Base Thickness (in) Thermal Performance (°C/W/3")

test-product

N/A N/A N/A N/A N/A

CH5111

7 7.38 3.13 0.5 0.3

CH5112

11.81 7.38 3.13 0.5 0.22

CH5113

7 7.38 3.32 0.5 0.3

CH5114

11.81 7.38 3.32 0.5 0.22

CH5115F

7 4.78 5.25 0.5 0.08

CH5116F

11.81 4.78 5.25 0.5 0.06

CH5117F

11.81 10.78 5.25 0.5 0.028

CH5118F

14 10.78 5.25 0.5 0.025

CH5119F

16 10.78 5.25 0.5 0.024

CH5120F

11.81 15 5.25 0.5 0.02

CH5121F

14 15 5.25 0.5 0.019

CH5122F

16 15 5.25 0.5 0.0175

CH6500F

5 5 1.5 0.5 0.1

CH6600F

8 5 1.5 0.5 0.08

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